薛红军,陶才勇,党思娜.基于双曲正弦函数的拓扑优化在热传导结构设计中的应用[J].航空工程进展,2020,11(3):370-379
基于双曲正弦函数的拓扑优化在热传导结构设计中的应用
Application of Topology Optimization Based on SINH in Design of Heat Conduction Structure
投稿时间:2019-09-04  修订日期:2020-01-03
DOI:10.16615/j.cnki.1674-8190.2020.03.011
中文关键词:  拓扑优化 SINH插值模型 传热模型 热传导结构 MATLAB
英文关键词:topology optimization, SINH interpolation model, Heat transfer model, Heat conduction structure, MATLAB
基金项目:国家自然科学基金(51975477,51705332)
作者单位E-mail
薛红军 西北工业大学 xuehj@nwpu.edu.cn 
陶才勇 西北工业大学 1163521088@qq.com 
党思娜 西北工业大学 dsnsw123@126.com 
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中文摘要:
      电子设备的热传导结构设计是解决飞机电子设备热防护问题的有效方法,基于经验的传统设计方法存在设计周期长,获得的结果性能并不一定优等问题,因此将拓扑优化应用在飞机电子设备散热设计中,能够快速获取较优的结构布局。建立基于双曲正弦函数(sinh函数)插值模型的热传导拓扑优化数学模型,将该模 型的算法应用于二维、三维热传导算例,并通过 MATLAB编程进行算法实现;该模型与SIMP模型和RAMP模型进行对比,并应用于机载 LRM 模块导热拓扑优化设计。结果表明:基于sinh函数的插值模型较 SIMP插值模型精确,较RAMP插值模型的迭代次数少,能更好地解决热传导结构拓扑优化设计问题。
英文摘要:
      In this paper, the topology optimization method based on SINH interpolation model in structural mechanics is applied in the design process of heat conduction structure, and a new mathematical model of topology optimization of heat conduction structure is established. By comparing the two-dimensional and three-dimensional heat conduction examples with the SIMP model and the RAMP model, it is concluded that the SINH interpolation model used in this paper is more accurate than the SIMP interpolation model, and has fewer iteration steps than the RAMP interpolation model. Therefore, the model established in this paper can better solve the topology optimization design problem of heat conduction structure.
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